As a kind of laser marker, the working principle of deep ultraviolet laser marker is the same with other laser marker mostly, but compared with other laser marker, deep ultraviolet laser marker has high photoelectric conversion efficiency, the life time of nonlinear crystal is long, modular design, easy installation and maintenance, the performance of machine is stability, small bulk, low power consumption, high marking speed, high efficiency etc.. In addition, the quality of deep ultraviolet laser beam is good, the focal spot is smaller, which makes it achieve ultra-fine marking. When marking with the deep ultraviolet laser marker, the thermal influence area is very small, and will not produce thermal effect, so material burning problem will never be considered. Deep ultraviolet laser marker is especially suitable for ultra-fine process, such as glass, mobile phone screen, precision instruments, etc., for most metal and non-metal materials, such as hardware, ceramics, nameplate, display boards, plastics, etc., it is competent too.
The main components of device are:
The working medium of the laser here is doped with trivalent neodymium ions in yttrium aluminum garnet (YAG) crystal, which has the feature of high gain, low threshold, high efficiency and low loss at 1064 nm etc., we use it to emit 1064 nm near-infrared laser here.
The chosen Q switch crystal is Cr YAG crystal, whose applied range is 900 – 1200 nm and 1350 – 1600 nm and the damage threshold is above 500 MW/cm2.
BBO crystal is adopted in the frequency multiplier to produce 266 nm deep ultraviolet Laser through quadruplicated frequency. which has a wide transmission band of 190 nm to 3500 nm, a large effective second- harmonic-generation (SHG) coefficient, a broad phase-matching range of 409.6 nm to 3500 nm, and a high frequency conversion efficiency.
- Environment friendly
- Portable, long life time and change module easily
- Small damage for subject
- High resolution of trace
- Mark in electronic components and hardware fitting field
- Mark in the wrapper of cosmetic，drug，food and other high molecular material
- Mark and scribe in flexible PCB
- Micro hole and blind hole processing in silicon wafer
- Anti-fake label