The green laser marking machine has a high electro-optical conversion rate over 30%~45%, low power consumption, and is developed by the world’s most advanced side or end pump technology at 532nm wavelength. Customers can choice their own pump type according to their demands. It is used for a wide range of applications, such as marking non-metallic materials, marking metallic materials, marking or calibrating optics, and perforating ceramic materials. In the same kind of products, the precision is higher.
The main components of device are:
The LBO crystal was selected for intracavity mixing to produce the desired 355 nm UV laser. The two LBO crystals are cut according to the phase matching angles of I and II respectively. The crystal end faces are plated with three-color antireflection coatings of 1064 nm, 532 nm and 355 nm, and the crystal placement meets the polarization matching conditions.
M1、M2 mirror——The inside of the M2 output mirror is coated with a film layer, which is reversed at 1064 nm and increases the transmittance at 532 nm.
A-Q——Continuous laser is modulated into lasers with different frequencies, high peak power, narrow pulse width and high repetition rate.
When the laser acts on the material to be processed, interaction process is mainly related to the power density of the laser, the action time, the material properties, and the wavelength of the laser etc. While the wavelength of 532nm green laser output is focused, the spot diameter is smaller, the energy is more concentrated, the electro-optical conversion efficiency is high, the beam quality is good, the marking accuracy is below 10μm, the marking frame is neat, no explosion point, no thermal deformation.
- Electro-optic conversion rate is high
- Low power consumption
- High precision
- Small spot diameter
- Good beam quality
- Energy concentration
- IC Chip Marking
The 532nm laser output from the green laser marking machine can be absorbed by almost all materials, the beam quality is good, the processing line is thin, and the marking quality is good. Due to IC area is small,there should be high accuracy while marking IC chip.The green laser has high precision characteristics, which is suitable for marking on the IC chip.
- Multiphoton Micro-ablation
Multiphoton micro-ablation on the surfaces of transparent materials. Single pulse ablation is obtained with pulses at 532nm. There are micron-size holes and channels engraved on in borosilicate glass, ion-doped waveguides and thermoplastic elastomer. Resulting microchannels are smooth and zones affected by thermal effects is very small.
- Laser Welding Of Plastics
There are many advantages in laser welding，such as high deposited energy， non-contact.In welding process,the laser light is easy to control and easy to automate.