The 355nm Nd:YAG laser has the advantages of good beam quality, stable power, high reliability, small size, and is easy to use, suitable for industrialization. It has been widely used in laser processing in bioengineering, material preparation, all-optical optics, integrated circuit boards and semiconductor industries.
Theotry
Frequency Conversion - LBO
The LBO crystal was selected for intracavity mixing to produce the desired 355 nm UV laser. The two LBO crystals are cut according to the phase matching angles of I and II respectively. The crystal end faces are plated with three-color antireflection coatings of 1064 nm, 532 nm and 355 nm, and the crystal placement meets the polarization matching conditions.
Gain medium - Nd YAG
AO-Q switch：TeO2
M1——a concave mirror plated with a full-reflection film for a wavelength of 1064 nm.
M2——Planar tri-color mirror, 45° reflection to the fundamental wave, 45° increase permeability on both sides to532nm and 355nm light wave.
M3——output mirror. The fundamental wave and the frequency-doubled light are all reflected, and the sum frequency is increased permeability.
M4——flat concave mirror. Fully reflect for 532nm and 355nm.
Ultraviolet lasers have three advantages in laser processing: First, they can process very small parts with a short wavelength. Second, ultraviolet laser processing materials directly destroy the chemical bond of the material, is a “cold” process, the heat affected area is small. Third, most materials can effectively absorb ultraviolet light.
- Good beam quality
- Power stability
- High reliability
- Ultraviolet light can be absorbed more effectively
- Cold process
- Biological Engineering
In the process of manufacturing a microfluidic chip by ultraviolet laser, the chemical bond in the molecule is directly cut, and the material is decomposed and removed. There is no need for a mask during laser direct writing to make a microfluidic chip. The entire production process is flexible and fast.
- Laser welding
The diffraction grating can be prepared by ultraviolet laser ablation. The computer control laser beam to write stripe structure of the grating on the surface of the material. The film in the writing area is ablated, and the substrate is exposed to form a grating structure on the surface of the material. The operation is simple, convenient and fast.
- Laser Hole Drilling
The application of UV laser on the circuit board is mainly to drill fine holes, cut flexible circuits, and manufacture and repair integrated circuit boards on polymer and copper layer distributed circuit boards. The UV laser can be used for holes below 25mm with high precision. Ultraviolet lasers can perforate, cut and weld on a variety of materials.
355nm Laser for Material Processing
355nm 550ps Microchip Laser System of MCB Series
MCB series microchip laser products have very ideal narrow pulse width, but also can achieve high single pulse energy. The product is a passive Q-switched solid-state laser based on semiconductor pump. The laser pulse is pure and tailless, the single pulse energy is stable, and the beam quality is good. The integrated design of semiconductor pump module and laser crystal makes the compact laser head easy to install and integrate. The system supports internal and external triggering. This series of products include four wavelengths of 1064nm, 532nm, 355nm and 266nm. The full sealing module inside the laser head can be used by customers for secondary development and application. The superior product performance index makes its application range very wide, especially in laser measurement, which can meet many different kinds of measurement needs, and also has excellent performance in the application of laser seeds.
Optical Parameter
| CL355-100Hz-25μJ-MCB004 | CL355-100Hz-35μJ-MCB005 | CL355-100Hz-70μJ-MCB006 | |
| Wavelength (nm) | 355 | 355 | 355 |
| Repetition Frequency (kHz) | 1 | 0.1 | 0.1 |
| Average Powe (mW) | 25 | 3.5 | 7 |
| Output Energy (uJ) | 25 | 35 | 70 |
| Pulse Width (ps) | 500 | 500 | 500 |
| Power Stability (8h) | ±3% | ±3% | ±3% |
| Beam Mode | TEM00 | TEM00 | TEM00 |
| Full-Angle Divergence Angle Typ. (Mrad) Level @ 1/e2 | ＜4 | ＜2 | ＜2 |
| Vertical @ 1 / e2 | ＜4 | ＜2 | ＜2 |
| Polarization Characteristics | ＞100:1 | ＞100:1 | ＞100:1 |
System Parameter
| CL355-100Hz-25μJ-MCB004 | CL355-100Hz-35μJ-MCB005 | CL355-100Hz-70μJ-MCB006 | |
| Power Input | 100-240 VAC,50/60Hz | 100-240 VAC,50/60Hz | 100-240 VAC,50/60Hz |
| Modulation Input | TTL0-5V,SMA interface | TTL0-5V,SMA interface | TTL0-5V,SMA interface |
| Control Interface | RS232、USB | RS232、USB | RS232、USB |
| System Power Consumption (W) | ＜35 | ＜25 | ＜15 |
| Power Supply Size (W × H × L, mm) | 150×76×146/150×76×200* | 150×76×146/150×76×200* | 150×76×146/150×76×200* |
| Laser Head Size (W × H × L, mm) | 45×30×120 | 45×30×120 | 45×30×120 |
| Working Temperature (℃) | 15-35 | 15-35 | 15-35 |
| Storage Temperature (℃) | 0-60 | 0-60 | 0-60 |
- Pulse width up to 500ps
- Pulse energy up to 170μJ
- External pump source fiber pump pulse
- Charge energy up to 360μJ
- Maximum repetition frequency up to 1kHz
- Beam mode is TEM00
- Fully sealed design, high reliability
- Seed source
- Micromachining
- Biomedical Science
- Laser ultrasonic inspection
- Laser ionization mass spectrometry
- Non-linear optical measurement
- Laser-induced fluorescence
- Laser induced breakdown spectroscopy
355nm 750ps Microchip Laser System of MCC Series
MCC series microchip laser products have very ideal narrow pulse width, but also can achieve high single pulse energy. The product is a passive Q-switched solid-state laser based on semiconductor pump. The laser pulse is pure and tailless, the single pulse energy is stable, and the beam quality is good. The integrated design of semiconductor pump module and laser crystal makes the compact laser head easy to install and integrate. The system supports internal and external triggering. This series of products include four wavelengths of 1064nm, 532nm, 355nm and 266nm. The full sealing module inside the laser head can be used by customers for secondary development and application. The superior product performance index makes its application range very wide, especially in laser measurement, which can meet many different kinds of measurement needs, and also has excellent performance in the application of laser seeds. We can also provide 1064nm and 532nm isolators.
| Model | Repetition Frequency | Average Power | Output Energy | Pulse Width |
| CL355-100Hz-150μJ-MCC005 | 0.1 kHz | 15 mW | 150 uJ | 700 ps |
| CL355-500Hz-90μJ-MCC006 | 0.5 kHz | 45 mW | 90 uJ | 700 ps |
| CL355-1KHz-15μJ-MCC007 | 1 kHz | 15 mW | 15 uJ | 700 ps |
| CL355-5KHz-10μJ-MCC008 | 5 kHz | 50 mW | 10 uJ | 700 ps |
| CL355-10KHz-10μJ-MCC009 | 10 kHz | 100 mW | 10 uJ | 700 ps |
- Pulse width up to 700ps
- Pulse energy up to 80 μJ
- External pump source fiber pump pulse energy can reach 500μJ
- Repetition frequency up to 10kHz
- Beam mode is TEM00
- Fully sealed design, high reliability
- Seed source
- Micromachining
- Laser ionization mass spectrometry
- Laser ultrasonic inspection
- Optical Parametric Oscillating Pump Source
- Biomedical Science
- Laser-induced fluorescence
- Laser induced breakdown spectroscopy
355nm 350ps Microchip Laser System of MCD Series
MCD series microchip laser is a passively Q-switched solid-state laser based on semiconductor pump. The laser pulse is pure and tailless, the single pulse energy is stable, and the beam quality is good. The integrated design of semiconductor pump module and laser crystal makes the compact laser head easy to install and integrate. The system supports internal and external triggering. This series of products include four wavelengths of 1064nm, 532nm, 355nm and 266nm. The full sealing module inside the laser head can be used by customers for secondary development and application. This series of lasers have great advantages in seed light, laser micromachining, laser measurement and other applications. We also provide 1064nm and 532nm isolators.
| Model | Repetition Frequency | Average Power | Output Energy | Pulse Width |
| CL355-100Hz-30μJ-MCD005 | 0.1 kHz | 3 mW | 30 uJ | 300 ps |
| CL355-100Hz-100μJ-MCD006 | 0.1 kHz | 10 mW | 100 uJ | 300 ps |
| CL355-500Hz-25μJ-MCD007 | 0.5 kHz | 12 mW | 25 uJ | 300 ps |
| CL355-1KHz-20μJ-MCD008 | 1 kHz | 20 mW | 20 uJ | 300 ps |
- Pulse width up to 300ps
- Pulse energy up to 150 μJ
- External pump source fiber pump pulse energy can reach 360μJ
- Maximum repetition frequency up to 1kHz
- Beam mode is TEM00
- Fully sealed design, high reliability
- Seed source
- Laser micromachining
- Non-linear optical measurement
- Laser-induced fluorescence
- Laser ionization mass spectrometry
- Fluorescence lifetime measurement
